From conductive polymers to organic metals
Article Abstract:
Organic metals, once a dream, then a disappointment, are now moving to the marketplace after 20 years of research according to the president and managing partner of Ormecon Chemie, Germany. Conductive polymers have turned out to be entirely different from what had been expected. Thinking about polyacetylene insolubility and lack of moldability led to research on this chemical and many polypyrroles, polythiophenes, and poly(perinaphthalenes), with concentration finally on polyanilines. Synthetic procedures that yielded a dispersible powder with an ultrafine primary particle size of 10-15 nm was found. Topics include true solutions of conductive polymers or lack thereof, dispersions as diverse nonequilibrium systems, corrosion protection, printed circuit board surface finish, organic and polymeric LEDs, organic metals and applications. Some research was done at Zipperling Kessler GmbH, parent of Ormecon, and a dispersion has been licensed to Covion Organi Semiconductors GmbH.
Publication Name: Chemical Innovation
Subject: Engineering and manufacturing industries
ISSN: 1527-4799
Year: 2001
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Inexpensive substrate cools chips
Article Abstract:
Sandia National Laboratories researchers have developed a substrate that helps keep chips and printed circuit boards closer to their optimal operating temperatures. The substrate, called 'microheat pipes' require no pumps or metal actuators with production costs estimated at $0.5 per square inch that is half of the production costs of current heat exchange electronic packing materials.
Publication Name: Quality
Subject: Engineering and manufacturing industries
ISSN: 0360-9936
Year: 1998
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Getting a grip on the grid
Article Abstract:
Rampant electricity disturbances in nations like Chile, Greece, Italy and Sweden as well as North America are attributed to inefficient policy and management. Reliability, as is evident from the electric outrages all over the world, is a global issue.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2005
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