Glass serves as wafer level packaging

Article Abstract:

Shellcase Ltd. of Jerusalem, Israel, has developed ShellPack, a wafer level chip scale packaging technology. The packaging consists of a thinned die that is sandwiched between two glass plates. The shell, 300 to 500 nm thick and no more than 100 micrometer longer or wider than the die, is designed for ultrathin applications such as smart cards and portable products. The technology, which is claimed to have 15% greater resistance than bare silicon of similar thickness, is also targeted as a replacement for direct chip attach (DCA).

Comment:

Develops ShellPack, a wafer level chip scale packaging technology

Semiconductor Devices, Article, ShellCase Ltd.

---

Absolute pressure control boosts oxide uniformity

Article Abstract:

Control of thickness uniformity has become more important and more difficult as gate oxides start to approach the theoretical minimum thickness. A new pressure controller promises to reduce the pressure- related oxide thickness fluctuations. Results of a measurement test using the new pressure controller indicate that it is ideal for use in thermal oxidations. It has the ability to control to a set absolute prpessure and minimize disturbance due to house exhaust changes.

Gate Array ICs, Gate arrays

---

Multidisciplinary approaches: target ES&H

Article Abstract:

The Environmentally Benign Semiconductor Manufacturing Engineering Research Center, located in Tucson, AZ, has developed a number of processing techniques aimed at minimizing, recycling and treating waste from IC manufacture. These include PFC replacement methods for chamber cleaning and etching applications and the generation of solventless, photoimagable, low-k dielectric components. Other approaches such as water use reduction and purification are also being studied.

Integrated Circuits

Similar abstracts:

• Abstracts: Olympus new cameras capture broader customer range. Mobile phone display orders rise amid handset demand. Sharp Corp
• Abstracts: GEC Plessey restructuring seems to be on track. Redesigning Mentor Graphics. AT&T micro targets systems solutions
• Abstracts: Clarion weaves solid strategy around electronic car networks. Mask system, car navigators rin in harmony with Kenwood's plans
• Abstracts: Global semiconductor sales in August set record. Semiconductor potential prompts multiple alliances. Semiconductor markets continue to surge
• Abstracts: LF982 signal level meters. MT210F, MT210 digital pressure meters. LV-5152D digital waveform monitors

This website is not affiliated with document authors or copyright owners. This page is provided for informational purposes only. Unintentional errors are possible.