FSA discloses 1999 survey results
Article Abstract:
The yearly Wafer and Packaging Demand Survey, conducted by the Fabless Semiconductor Assn of Dallas, TX, reveals that respondents anticipate 43% improvement in 200mm wafer requirements in 1999 against actual purchases in 1998. During 1999 and 2000, wafer requirements are anticipated to increase by about 43% and 13%, respectively. The survey's respondents were comprised of a small sampling of the whole fabless group made up of nearly 600 firms around the world.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
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Detecting non-visual defects is vital for 0.18 micron
Article Abstract:
Rapid yield improvement requires the clear identification of the source of non-visual defects in semiconductor wafers. Manufacturers of large, high- speed semiconductor deices must monitor and control non-visual defects and very low parasitic currents that have become dominant in determining device yields. This has resulted in newer parametric test system designs which employ per pin electronics, low leakage switch boards and other noise reduction methods.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 2000
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