Making room for more performance with chip scale packages

Article Abstract:

After being introduced in Japan in the early-1990s, chip scale packaging (CSP) is now widely-implemented in the US semiconductor industry, where it was presented in 1994, as a less-costly substitute to multichip modules (MCMs). As compared to direct chip attach (DCA) methods such as chip on board (COB) and flip chip on board (FCOB), chip scale packaging provides comparable space and material savings and short signal paths, as well as easier handling, more protection for the chip, and simpler board assembly. Spurred predominantly by demand from the personal application market, there are now more than 50 various CSPs, classified into the general types of flexible interposer, custom leadframe, rigid substrate and wafer level package.

Comment:

Chip scale packaging is now widely-implemented in the US semiconductor industry

Manufacturing processes

---

FLCs introduced for miniature displays

Article Abstract:

Displaytech of Longmont, CO, has unveiled a ferroelectric liquid crystal (FLC) projection display technology. The new display technology uses an actual silicon device to run the display, resulting in added reliability. The technology's design eliminates the need for color filters as light emitting diodes are on only when needed. The technology also does not use subpixels or color triads, thus resulting in a sharper image. The design also results in a smaller display that may be had at a less expensive cost.

Comment:

Unveils a ferroelectric liquid crystal projection display technology

Product development, Other Electronic Component Manufacturing, Liquid Crystal Displays, Displaytech Inc.

---

New materials enhance memory performance

Article Abstract:

High-k materials are expected to be incorporated by the semiconductor industry as it focuses on the development of higher-density memory devices. These materials include tantalum pentoxide, paraelectric perovskites, ferroelectric materials, electrode materials and magnetic materials. The development of memory devices using these high-k materials are described.

Use of materials & supplies

Similar abstracts:

• Abstracts: Flip-chip packaging: prepare for ramp-up. More chip-scale packages? MCM has chips in redistribution
• Abstracts: Improved PEAKS means peak performance for large PDP TVs. Panasonic's newest memory card safeguards information
• Abstracts: The expanding role of venture capital. Market jitters and the mid-term economic risk. Pressure from the pump
• Abstracts: Entertainment systems compete head-on with PCs. NT workstations take on RISC
• Abstracts: Entertainment systems compete head-on with PCs. Zenith channels TV projects to teams

This website is not affiliated with document authors or copyright owners. This page is provided for informational purposes only. Unintentional errors are possible.