Pressure measurement and control keep pace with processing

Article Abstract:

The changing procedures in semiconductor manufacturing present a continuous challenge to suppliers of pressure management and control (PM&C) equipment. The switch from traditional CVD procedures to high-density plasma CVD processes has resulted in a drastic drop in operating pressures from the tens or hundreds millitor level to 1 or 2 millitor. Another equally challenging aspect for PM&C makers is to supply the requirements of current high-temperature processes.

Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables, Pressure Controllers

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Spin processing offers yield enhancement for 300 mm

Article Abstract:

The SEZ Group of Zurich, Switzerland has received numerous orders for its 300 mm spin processors from major chipmakers in Asia, Europe and the US. The spin processors will be used in the surface preparation of 300 mm wafers basically to improve yield by achieving wafer back-side cleaning, especially copper decontamination and also to recycle monitoring wafers. The company reported that its orders have amounted to almost $6 million.

Switzerland, New orders received

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SVG takes 'extreme' attitude toward exposure

Article Abstract:

Silicon Valley Group Inc of San Jose, CA, announced in 1999 that it will commercially produce a lithography system using extreme ultraviolet (UV) rays by 2007. Aside from a system that utilizes extreme UV rays, manufacturers of semiconductor production equipment are considering another system that uses high-energy electron beams. One such device is the Scalpel system developed by Lucent Technologies Inc.

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