Applied's module approach jumpstarts transition to copper
Article Abstract:
Applied Materials Inc of Santa Clarca, CA, has developed a module approach in providing its customers with semiconductor production equipment. The company's Equipment Process and Integration Center emulates a self- contained pilot line where customers can bring wafers to evaluate Applied's copper interconnect technology. The approach allows semiconductor device makers to acquire a ready-made technology module, providing a baseline which can be adopted to a specific process.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
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Inspection, measurement & test
Article Abstract:
KLA-Tencor of San Jose, CA, is unveiling its 2401 Automated Macro Defect Inspection System that is expected to be the replacement device for current macro after-develop inspection systems used in the lithographic industry. The device is claimed to be capable of automatic detection of yield-critical defects that include scratches, hot spots, extra and missing resist, large particles, striations and developer spots, unexposed fields and splash-back.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
User Contributions:
Comment about this article or add new information about this topic:
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