Indium phosphide ICs: unleash the high-frequency spectrum

Article Abstract:

The design and uses of indium phosphide heterojunction bipolar transistors (HBT) are discussed. The technologies that this type of high-speed ICs have bred are also described.

Product information, Processor speed, Performance improvement, Processor speeds, Performance improvement (Computers)

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A little light magic: circuit designers are playing optical tricks to make nanoscale structures on ICs

Article Abstract:

New techniques involving optical lithography are enabling integrated circuit (IC) manufacturers to create patterns smaller than the wavelength of light and to produce them.

Forecasts, trends, outlooks, Integrated & Hybrid Circuits, Research, Semiconductor chips, Forecasts and trends, Market trend/market analysis, Nanotechnology, Industry forecasts, Standard IC, Circuit designer, Lithography (Circuit fabrication)

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The via squeeze

Article Abstract:

Space constraints are causing designers to use microvias, which are holes so tiny they cannot be mechanically drilled, to connect the circuitry of one board layer to another. Vias now typically need to be less than 0.1 mm in diameter, and space for them is continuing to shrink. Instead of being drilled, they have to be made by alternative processes, such as laser ablation, or by photochemically etching thin dielectrics built up on the sides of a circuit board core. Microvias are becoming a crucial technology for meeting the electronics industry's needs in the areas of interconnections and packaging, and at the same time, microvia technology's transformations are forcing product and business changes throughout the printed-circuit supply chain.

Semiconductor Devices, Methods, Analysis, Semiconductor device, Electronic components, Printed circuit boards, Circuit printing

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