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Multichip modules: next-generation packages

Article Abstract:

Multichip modules interconnect several bare dice through use of a stack of conductive and dielectric thin films; such devices have been available for some time, but recent advances have improved the performance and reduced the cost of the technology. Multichip modules are divided into three categories: MCM-L are high-density laminated printed circuit boards, MCM-C are ceramic substrates that are cofired or low-dielectric-constant (K) ceramics, and MCM-D are modules with deposited wiring on silicon substrates or ceramic and metal substrates. MCM-D devices have increasingly high wiring densities of up to 80 percent of the substrate footprint, compared to about 10 percent for conventional printed circuit boards; MCM-Ds are being used or tested by AT&T, Boeing, Rockwell International, HP and Hughes Aircraft, among others. Chip design requirements, different design approaches and connecting chips to substrates are discussed.

Author: Johnson, Robert R.
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1990
Circuit design, Product introduction, Increase, Packaging Density, New Technique, Enhancements, technical, Substrates, Chip Packaging

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Negotiating roadblocks

Article Abstract:

The goals of increasing density and performance in integrated circuit (IC) technology are driving developments in ever-finer feature size (scaling), multichip packaging, multiple-layer interconnection, integration of process technologies, development of neural networks, and ever-more dense cell-based ICs. Current 0.8-micron process scales will have to decrease to 0.2-micron to achieve 256M-bit memory ICs and 50-million-transistor logic chips by the year 2000. The integration of bipolar and CMOS process technologies are intended to increase the performance-to-cost ratio of IC devices. Metal interconnections now offer three-to-four layers, but the scaling of ICs to less than 1-micron increases the parasitic and cross-talk problems to be resolved. Other trends discussed include neural network, flash memory, smart power IC, and gate array developments.

Author: Barrett, Craig R.
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1990
Semiconductor industry, Integrated circuit fabrication, Performance improvement (Computers), Trends, Miniaturization, Performance Improvement

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Subjects list: Integrated circuits
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