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Engineering and manufacturing industries

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Hydrogen production in one step

Article Abstract:

Caloric Anlagenbau GmbH of Grafelfing, Germany, has perfected a process of producing hydrogen from propane, naphtha or natural gas. Using a single catalytic steam-reforming procedure combined with pressure-swing absorption at 15 bars, the company was able to obtain hydrogen of 99.999% purity by volume. Caloric's process, which combines all the required steps in a single procedure, is able to lower equipment cost to about two-thirds of the conventional means of hydrogen production.

Author: Parkinson, Gerald
Publisher: Access Intelligence, LLC
Publication Name: Chemical Engineering
Subject: Engineering and manufacturing industries
ISSN: 0009-2460
Year: 2000
Manufacturing processes, Industrial Gas Manufacturing, Hydrogen, Caloric Anlagenbau GmbH

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One plant's waste is another plant's feed

Article Abstract:

Kemgas Ltd of Ferney Voltaire, France, will construct a 40,000-mt/yr precipitated calcium carbide (PCC) plant in Leuna, Germany, that will utilize waste acetylene slime and carbon dioxide as raw materials. The plant, which is set to begin operations in 2001, will produce high-quality PCC using a proprietary mix of two solvents. Kemgas' technique is also capable of producing PCC crystals of more regular sizes and shapes at a faster and more economical pace.

Author: Parkinson, Gerald
Publisher: Access Intelligence, LLC
Publication Name: Chemical Engineering
Subject: Engineering and manufacturing industries
ISSN: 0009-2460
Year: 2000
Facilities & equipment, Calcium Carbide, Kemgas Ltd.

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SiLK upstages silicon dioxide in semiconductor chips

Article Abstract:

IBM will start using Dow Chemical's SiLK aromatic polymer instead of silicon dioxide (SiO2) for its semiconductor chips, which it expects will increase chip operating speed by 30%. The faster chip speed is made possible by SiLK's low dielectric constant, which is only 2.65 as against 4.0 for SiO2. This will allow IBM to fabricate ICs with line widths of 0.13 microns compared to 0.18 microns for other commercial ICs. SiLK also has a thermal stability of 450 degrees C, which makes it suitable for semiconductor-manufacturing processes.

Author: Parkinson, Gerald
Publisher: Access Intelligence, LLC
Publication Name: Chemical Engineering
Subject: Engineering and manufacturing industries
ISSN: 0009-2460
Year: 2000
United States, Semiconductor and Related Device Manufacturing, New orders received, Use of materials & supplies, Silicon & Inorganic Compounds, Silicon Chips, International Business Machines Corp., Dow Chemical Co. (Midland, Michigan)

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Subjects list: Germany
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