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Share of foreign chips in Japan's market slips

Article Abstract:

US and Japanese government officials announce that the market share of imported integrated circuits in the Japanese market fell to 19.2 percent in 2nd qtr 1993. US government and semiconductor industry officials express dismay at the news, which throws a pall over the last of four days of trade talks between the two countries in Hawaii. The news will likely have an impact as well on Pres Clinton's first meeting with Japan's Prime Minister Morihiro Hosokawa at the UN building in New York Sep 22, 1993. Bowing to US pressure, in 1991 Japan set a 20 percent target for the market share of imported integrated circuits by 1992, an agreement the Clinton administration considers a model for opening up trade to Japan. Japan met this target for the first time in 4th qtr 1992, when import sales reached 20.2 percent. Unfortunately, import market share declined to 19.6 percent in 1st qtr 1993 and has now fallen to 19.2 percent.

Author: Bradsher, Keith
Publisher: The New York Times Company
Publication Name: The New York Times
Subject: News, opinion and commentary
ISSN: 0362-4331
Year: 1993
Japan, Integrated circuits, International trade, Integrated circuit fabrication, Market Share, Second Quarter

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U.S. plans to offer aid, not protection, in chips

Article Abstract:

The Commerce Dept rules that US manufacturers of ceramic integrated-circuit packages do not have enough national-security importance to merit restrictive-trade protection from such industry-dominant foreign competitors as Japan's Kyocera Corp. Instead, Commerce unveils a plan to increase the domestic chip-packaging industry's competitiveness with a federally funded research center and increased Energy Dept and National Institute of Standards and Technology research spending. The Defense Dept will also give advice on securing military contracts, and a government-industry working group will uncover ways to increase productivity. Commerce's action comes in response to a Coors Electronic Package Co and Ceramic Process Systems Corp petition for national-security protection under Sec 232 of the Trade Enhancement Act of 1962. Annual US spending on chip packages is about $1.2 billion.

Author: Bradsher, Keith
Publisher: The New York Times Company
Publication Name: The New York Times
Subject: News, opinion and commentary
ISSN: 0362-4331
Year: 1993
Commercial physical research, Admin. of general economic programs, Finance, Political activity, Industrial research, Economic policy, Political aspects, Kyocera Corp., KYO, United States. Department of Commerce, Research and Development, Manufacturers, Management Consulting, Government Funding, Foreign Competition, Government aid, Chip Packaging, Electronic ceramics, Ceramics Process Systems Corp., Coors Electronic Package Co., CPSX

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Subjects list: Semiconductor industry, Market share
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