A visco-plastic constitutive model for 60/40 tin-lead solder used in IC package joints

Article Abstract:

A new visco-plastic constitutive model for 60 weight percent Sn-40 weight percent Pd (60 Sn-40 Pb) solder alloy used in integrated circuit package joints is evaluated. The cyclic stress and stress properties of 60 Sn/40 Pb bulk solder under isothermal displacement-controlled conditions are determined by means of cyclic torsion tests. The required model equations are then derived based on the test results. Evaluation of the model indicates that it is capable of accurately predicting solder deformation processes in the monotonic, cyclic and creep regimes.

Materials, Creep (Materials)

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On the constitutive response of 63/37 Sn/Pb eutectic solder

Article Abstract:

A study characterizes the rate dependent plasticity of 63/37 Sn/Pb eutectic solder alloy based on the Bodner-Partom (BP) unified creep-plasticity model. The model is considerably strain rate sensitive for lower strains. The BP material parameters are useful for enhancing the reliability of solder joints in electronic packaging. The uniaxial tension stress-strain tests are performed for a set of applied strain rates.

Analysis, Strains and stresses, Stresses (Materials), Alloys

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Mechanistic prediction of fracture processes in ferritic steel welds within the transition temperature regime

Article Abstract:

A computational and probabilistic-based mechanistic approach was developed to predict the fracture formation in ferritic steel welds in the transition temperature region. The numerical predictions were compared with finite element-derived fracture toughness data and true cleavage probability density functions at different temperatures. The predicted results were found to agree well with experimental results.

Welded joints, Fracture mechanics, Steel

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