High-density interconnect and packaging - How to design and implement for products

Article Abstract:

There is a need to miniaturize the electronics content of products and this can be satisfied by high-density interconnection and packaging solutions. New styles of package for individual ICs have been introduced and there is growing use of unpackaged ICs. The drivers and benefits of miniaturization are discussed and technology options for high density interconnect and packaging are considered. Future developments may see easier to insert components and the integration of passive components.

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Silicon MCM-D technology for RF integration

Article Abstract:

Integrated RF system design is constrained by the availability of suitable and cost-effective components. MCM-D technology enables different families of ICs to be integrated using integrated passive components. The GEC Plessey Semiconductors (GPS) MCM-D technology for RF integration applications is described and the range of integrated passive resistor, capacitor and inductor components that can be identified in the substrate structure are reviewed.

Usage, Wireless LANs, Silicon, Wireless local area networks (Computer networks)

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A high-resolution miniature colour liquid crystal display

Article Abstract:

Single-crystal silicon technology provides a method of producing active matrix backplanes for miniature displays. A miniature colour display was developed, with a wide colour gamut, using red, green and blue LEDs. Single metal planarization is useful with LEDs, although double metal planarization is needed with high intensity illumination sources. Issues of cell uniformity and liquid crystal defects are still to be addressed.

Electronic components, not elsewhere classified, Other Electronic Component Manufacturing, Liquid Crystal Displays

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