LSIs stack up memories within packages
Article Abstract:
Sharp Corp. has developed the first series of stacked chip-sized packages. With each containing two LSI chips, the packages are designed to meet demand for drops in LSI package sizes. The 8 x 8mm versions hold 16 eight-bit flash memories and 16 11M-bit SRAMs; the 8 x 11mm versions integrate 16 16M-bit flash memories and eight 12M-bit SRAMs; and the 8 x 10mm version carry eight 16M-bit flash memories and eight 12-bit SRAMs. A die-bonding process developed by the company's engineers ensures that chips are bonded onto package substrates.
Comment:
Develops the first series of stacked chip-sized packages
Publication Name: Office Equipment & Products
Subject: Computers and office automation industries
ISSN: 0387-5245
Year: 1998
User Contributions:
Comment about this article or add new information about this topic:
Intel, Via settle squabble about chip set designs
Article Abstract:
United States-based Intel Corp. and Taiwan-based Via Technologies Inc. will settle a group of intellectual property lawsuits.
Publication Name: Office Equipment & Products
Subject: Computers and office automation industries
ISSN: 0387-5245
Year: 2000
User Contributions:
Comment about this article or add new information about this topic:
- Abstracts: It's all in the extras. Fast, flexible & built to last. Sharp SE-500
- Abstracts: Panasonic plays up light features in latest LCD projectors. Multimedia projectors handle A4 documents, offer zooming, deliver brightness
- Abstracts: Hunter Group gathers IT self-service practice. Put help desk, field service in analyis
- Abstracts: LCD features wide angles, works with personal computers. 18.1-inch TFT color LCD serves workstations
- Abstracts: Monochrome printer handles panorama shots. Notebook computers use advanced processors. Handheld computer handles both key, pen input