High-density etch helps keep Moore's law alive
Article Abstract:
An expectation has been created that microprocessors and other ICs will continue to make large performance improvements while declining in price. Productivity gains in the semiconductor industry have been made through continuous improvements in both existing equipment and processes. One of the most significant technological advances in the manufacture of semiconductors is the single-wafer, dry-etch process, which replaced the wet-etch batch process. Now, a new high-density plasma etch source may replace the existing parallel-plate capacitive reactors with inductively coupled high-density plasma sources. The new technology permits the process chamber to run under low-pressure conditions. Low pressure introduces several key advantages, including an improved critical dimension control and minimized microloading.
Publication Name: Electronic Business Today
Subject: Electronics and electrical industries
ISSN: 1085-8288
Year: 1996
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Integrated processes reduce set-up time
Article Abstract:
The process of manufacturing computer chips involves moving wafers through hundreds of steps. A smooth hand-off between processes requires process integration. Managing this integration can involve technologies from multiple suppliers, and may take months to design before the fab is ready for production. Prequalified process modules could simplify this process, and save a great deal of money. Process sequence integration (PSI) is a model where the supplier integrates the performance of various process modules prior to shipment. The process supplier, rather than the manufacturer, is better positioned to do this integration. This model would reduce start-up time, and would achieve a higher level of standardization between diverse facilities.
Publication Name: Electronic Business Today
Subject: Electronics and electrical industries
ISSN: 1085-8288
Year: 1996
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Rising to the challenge of cost of ownership
Article Abstract:
Semiconductor companies are investing billions of dollars in new wafer fabs to meet rising demands. This substantial investment requires the companies to control the cost of ownership, primarily by delivering higher throughput and better reliability. In the past, the industry has controlled the cost of ownership with continuous advances in technology, although the tools to produce these advanced products are more costly and operate at lower rates of productivity. The industry appears to be approaching a point of diminishing returns, and the most likely way to enjoy continued success is now through increasing the number of wafers that can be processed per hour.
Publication Name: Electronic Business Today
Subject: Electronics and electrical industries
ISSN: 1085-8288
Year: 1996
User Contributions:
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