PSGAs for fast production and ramp
Article Abstract:
Siemens Semiconductor Manufacturing Systems of Norcross, GA and IMEC of Leuven, Belgium have jointly developed a polymer stud grid array (PSGA) packaging format, which can be utilized for cavity-down, flip-chip, die-up and thermally-enhanced cavity-down configurations. Utilizing a polymer material for the package body and studs with laser patterning to create interconnect patterns, the packaging format offers the manufacturing advantages of speed and waste reduction. In addition, a new package design only requires a new injection molding and patterning data for the laser.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1998
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Advanced process control: soon to be a must
Article Abstract:
Advanced process control (APC) will soon be considered necessary in semiconductor production because of its great potential to reduce scrap, boost time between preventive maintenance operations and make more devices bin out at higher performance levels. As an APC category, run-to-run control of a process on a device utilizes information from incoming and outgoing wafers to adjust process parameters.
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
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