Sun Microelectronics launches a line of Java processors

Article Abstract:

Sun Microelectronics, a division of Sun Microsystems, is enjoying rapid growth and has set a target of $1 billion a year in revenue. The division was created to provide SPARC chips for workstations, although its biggest potential for growth now lies in embedded computing. A majority of Sun Microelectronics' revenue comes from chip sales, with the highest growth being seen in the sales of embedded systems. The division may also enjoy rapid success through Sun's Java chips. These chips are optimized to run Java programs for Internet operations. There will be three different Java chips, starting with the PicoJava, which is meant for cellular phones and other consumer produts. The MicroJava core adds application-specific I/O and communications functions, and is meant for networked devices. The fastest of the three, the UltraJava, includes advanced graphics and is designed for 3D graphics and multimedia applications.

Usage, Computer hardware, Microprocessor, Product introduction, CPUs (Central processing units), Product Announcement, Microprocessors, Sun Microsystems Inc., SUNW, Hardware product introduction, Scalable Processor Architecture, SPARC processors, Sun PicoJava (Microprocessor), Sun MicroJava (Microprocessor), Sun UltraJava (Microprocessor)

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Conductive-epoxy bumps could displace solder

Article Abstract:

Conductive adhesives are expected to eliminate the use of soldering techniques in the flip-chip market. One company, Epoxy Technology Inc, has developed a patent that will put semiconductor chips directly on the substrate with conductive polymer-epoxy bumps. Epoxy Technology's technique is less-expensive than conventional solder bumps because it requires lower temperatures and has fewer process steps. Also, since the final product weighs less, heat dissipation and electrical performance is improved, and chip densities are larger. Though Epoxy Technology holds important patents in the industry, other companies such as Alpha Metals Inc and Dexter Corp are venturing into electrically conductive polymer adhesives. Universal Instruments Corp is considering a cooperative arrangement with suppliers to put conductive adhesives into a production environment.

Semiconductor devices, Semiconductor device, Electronic components, Forecasts and trends, Industry trend, Intellectual property, Epoxy Technology Inc.

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