A silicon compiler for digital signal processing: methodology, implementation and applications
Article Abstract:
A silicon compiler called BSSC is described that uses a bit-serial architecture with a 1.25-micrometer CMOS cell library to translate a high-level behavioral description of a circuit into structural components. The BSSC accepts high-level description language tailored for digital signal processing (DSP) algorithms as input. The compiler decides how to build the circuit, what components to use, and how to interconnect the components, and has been used in several applications producing working chips. The BSSC is equipped with behavioral, logic, and fault simulators, and performs placement and routing. The implementation of classical DSP algorithms using the silicon compiler are explored: digital filters; FFT; programmable filters; adaptive algorithms; and waveform synthesis. Techniques are presented to implement more complex mathematic functions common to DSP.
Publication Name: Proceedings of the IEEE
Subject: Electronics
ISSN: 0018-9219
Year: 1987
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Growth and characterization of diamond films on nondiamond substrates for electronic applications
Article Abstract:
Doped diamonds provide high hole mobility, wide band gap and high breakdown voltage, which may eventually allow the devices to be used to develop active semiconductor diamond elements for high power/high frequency electronic devices and devices for use in high-temperature, chemically harsh and/or high radiation flux environments complementing silicon and gallium arsenide (GaAs) technologies. Recent advances in the chemical vapor deposition (CVD) and characterization of diamond films on nondiamond substrates are reviewed. Among the primary growth techniques are hot filament CVD, microwave, radio frequency or dc plasma enhanced CVD and combustion flame growth. Diamond phase identification, nucleation and interfacial phenomena, morphology and defects are discussed in terms of their correlations with electrical properties.
Publication Name: Proceedings of the IEEE
Subject: Electronics
ISSN: 0018-9219
Year: 1991
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Sensor-Based Robotic Assembly Systems: Research and Applications in Electronic Manufacturing
Article Abstract:
Assembly in a manufacturing process includes forming of parts, presentation of parts and joining or bonding of parts. Robotic systems offer tremendous promise for the automation of many manufacturing tasks. A sensor-based robotic assembly system is described in detail. Design considerations in manipulators and sensors' design are discussed. A block diagram shows a visual servo control system.
Publication Name: Proceedings of the IEEE
Subject: Electronics
ISSN: 0018-9219
Year: 1983
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