Multichip packaging - a tutorial
Article Abstract:
Multichip packaging began with mainframe and supercomputer applications requiring the greatest number of circuits to be packaged in the least amount of space. The same attributes are now being transferred to workstations, consumer electronics, medical technology, aerospace, automotive industry, and telecommunications. The bipolar and CMOS integrations expected in the mid to late 1990s will require packaging of a smaller number of chips on smaller-sized substrates and having multiple functions that cannot be fulfilled by individual chips. The current multichip market is estimated at $2 billion, mostly by integrated system companies, but it is expected to grow to $4 billion by 1995 and $10 billion by 2000. The state of the technology is examined, and such packaging technologies as sealing and encapsulation, heat removal, chip-level connections, thin film, ceramic and printed wiring substrates, module connections, and electrical testing in forming a high-performance portable system are described.
Publication Name: Proceedings of the IEEE
Subject: Electronics
ISSN: 0018-9219
Year: 1992
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Prolog to Imaging radar polarimetry: a review: a tutorial introduction to the paper by Zebker and van Zyl
Article Abstract:
Engineers are moving closer to the remote sensing of surface details with emerging techniques in imaging radar polarimetry. Imaging radar polarimetry is based on the principle that the reflected energy's polarization properties will be altered by the surface to a greater or lesser degree. The new techniques make it possible to determine certain properties of surfaces within the scene by measuring the details of the polarization of the scattered energy at each point in a scene. The requirements needed to apply the theory are discussed.
Publication Name: Proceedings of the IEEE
Subject: Electronics
ISSN: 0018-9219
Year: 1991
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