Polymer dielectrics for multichip module packaging
Article Abstract:
Conventional chip packaging and interconnect will not meet the needs of future advanced computer systems. Interconnect technologies will need to deliver shorter signal paths, lower capacitive load, and reduced circuit noise to meet the needs of future high-speed devices. Multichip module deposited (MCM-D) involves interconnecting multiple bare dies on structures fabricated by multilayering and patterning thin films of conductor metallization and low dielectric constant 'deposited' polymer on a base substrate that may or may not have noncritical interconnect pathways within it. Polymer performance is based on the relationships between adhesion, stress, moisture absorption, and thermal and chemical stability, as well as the inherent electrical and mechanical properties of the polymer. Commercial materials based on polyimides or benzocyclobutenes are examined, and how their properties affect the overall performance and reliability of MCM structures is discussed.
Publication Name: Proceedings of the IEEE
Subject: Electronics
ISSN: 0018-9219
Year: 1992
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High-yield assembly of multichip modules through known-good IC's and effective test strategies
Article Abstract:
Multichip module packaging and interconnection techniques to date focus on housing each integrated circuit in its own single-chip package and mounting a collection of the needed packages onto an interconnecting printed circuit board. As IC clock rates increase above 40 MHz and IC pin counts move into hundreds of pins, however, circuit board assemblies begin to experience serious performance, size, and reliability limitations. Solutions to these packaging constraints include combining several ICs into a single, more highly integrated IC chip; reducing the package size and spacing between perimeter leads to allow shorter chip-to-chip signal paths; reducing the dielectric constant in the circuit board to shorten propagation delays; and implementing full transmission line design solutions. The history of multichip packaging and new demands for known-good ICs entering assembly are examined.
Publication Name: Proceedings of the IEEE
Subject: Electronics
ISSN: 0018-9219
Year: 1992
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Design of multichip modules
Article Abstract:
Multichip module (MCM) design involves materials; electrical, thermal, and mechanical performance; system architecture and requirements; and economics. The key to MCM design is the global optimization of these constraints. The considerations required in the design process are examined, and figures of merit to help designers in making choices are presented. Among the important criteria for MCM design are that it provide the proper operating environment for the chips it holds; that it fit the constraints of the system that holds it; that it be manufacturable, testable, and repairable; and that it provide some clear benefit to the system at an affordable price.
Publication Name: Proceedings of the IEEE
Subject: Electronics
ISSN: 0018-9219
Year: 1992
User Contributions:
Comment about this article or add new information about this topic:
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