Thermal design ensures RF power-amp reliability
Article Abstract:
The reliability of power-amplifier integrated circuits (ICs) depends on compliance to appropriate thermal-management rules in the operation and the design of any RF component. Heat needs to be efficiently and effectively removed from the junction of any semiconductor, which is capable of dissipating reasonable power amounts, so as to prevent problems caused by the accelerated aging process. Ultimate failure and performance degradation for the device can also be hastened by a substantial increase in the junction temperature of the device.
Comment:
Reliability of power-amplifier ICs depends on compliance to appropriate thermal-mgmt rules in operation & design of RF component
Publication Name: Microwaves & RF
Subject: Engineering and manufacturing industries
ISSN: 0745-2993
Year: 1998
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Multi-harmonic method optimizes power amplifiers
Article Abstract:
The multi-harmonic load-pull tuning technique has been shown to be more efficient in enhancing amplifier performance compared to the conventional mono-harmonic optimization technique. The method, using multiple harmonic frequencies to create simultaneous optimization, result in improved microwave power amplifier harmonic output. The multi-harmonic load-pull tuning method, which can be utilized with any type of device of any operating class, proves to be highly suitable for amplifiers running in the Class F mode.
Publication Name: Microwaves & RF
Subject: Engineering and manufacturing industries
ISSN: 0745-2993
Year: 1998
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Choosing passive components for high-power amplifiers
Article Abstract:
A high-power amplifier's overall electrical and mechanical performance can be enhanced through careful passive-component selection, which has an impact in many cases on an RF power amplifier's topology. Passive components are crucial for the overall performance of high-power amplifiers, even though greater interest is given to the RF-amplifier-design's active aspect. Designers of high-power amplifiers also need to ensure that devices such as power resistors are heat-sink mounted and are conduction-cooled.
Comment:
High-power amplifier's overall electrical & mechanical performance can be enhanced through careful passive-component selection
Publication Name: Microwaves & RF
Subject: Engineering and manufacturing industries
ISSN: 0745-2993
Year: 1998
User Contributions:
Comment about this article or add new information about this topic:
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