Uniform electrochemical deposition of copper onto self-assembled gold nanoparticles

Article Abstract:

Assemblies of gold(core)/copper(shell) nanoparticles could be prepared through the electrochemical deposition of copper metal onto self-assembled gold colloids that are immobilized via an organic film onto conductive substrates. From a simplified model, we derive formulas for the criteria to ensure the deposition independence, demonstrating the required experimental conditions of particle size, assembly density, and the ratio of the surface concentration to the bulk concentration of depositing species.

Primary nonferrous metals, not elsewhere classified, Primary Smelting and Refining of Nonferrous Metal (except Copper and Aluminum), Gold, Copper, Electrochemical analysis

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Reproducible patterning of single Au nanoparticles on silicon substrates by scanning probe oxidation and self-assembly

Article Abstract:

A rational approach for reproducibly patterning single Au nanoparticles, 15-20-nm diameter, on silicon wafer substrates is described. The approach uses scanning probe oxidation (SPO) to pattern silicon oxide nanodomain arrays on silicon substrates modified with octadecyltrimethoxysilane (OTS).

China, Observations, Oxidation-reduction reaction, Oxidation-reduction reactions

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Monitoring gold nanorod synthesis by localized surface plasmon resonance

Article Abstract:

The geometrical dependence of the localized surface plasmon resonant extinction spectrum of gold nanorods is examined to monitor their synthesis kinetics. The rate dependence on nanorod size has not corresponded to any simple reaction-limited or diffusion-limited growth mechanisms.

Surface active agents, Surface Active Agent Manufacturing, Structure

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