Bonding of CMOS processed wafers to glass substrates

Article Abstract:

Inter-University Microelectronics Centre (IMEC) in Leuven, Belgium, is studying the practicality of anodic bonding and adhesive bonding for CMOS processed wafers to glass substrates. According to the IMEC research, anodic bonding causes degradation of capacitors since metal routing was in direct contact with the glass during bonding. Meanwhile, with adhesive bonding, problems with relation to bubble formation occurred during etch-back of adhesive bonded CMOS processed SIMOX wafers. However, with adhesive bonding, the quality of the die remained good.

Comment:

Belgium: Inter-University Microelectronics Centrem, Leuven studies bonding for CMOS processed wafers to glass substrates

Semiconductor Devices, Science & research, Article

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IMEC finalizes 0.35 um BiCMOS integration

Article Abstract:

An epitaxial base technology for BiCMOS devices has been formulated by the Inter-University Microelectronics Centre in Leuven, Belgium. The technology utilizes a process that can yield a device with extremely low parasitics, ideal base current, current gain of over 80 and increased breakdown voltages. The technology blends good analog preformance and high-speed performance to produce high-frequency products.

C-MOS Integrated Circuits, Complementary metal oxide semiconductors

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