Water spots: the scourge of wafer dryers

Article Abstract:

Water spots pose a significant challenge in the drying of silicon wafers. Water spots form when dissolved, non-volatile material (often silica) is left behind as water droplets start to evaporate. Water spots are capable of causing problems with adhesion of films, contact resistance, non-uniformity between conducting layers and gate oxide defects, according to Steve Bay, West Chester, PA-based CFM Technologies' vice president and chief technical officer. Under CFM's Full Flow System used Direct Displace drying technology to eliminate watermarks, critical to the success of HF-last processing.

Manufacturing processes, Article

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Advancing aluminum interconnect technology

Article Abstract:

Semiconductor firms are investigating many new aluminum-based interconnect systems, in order to surpass capability of filling 3:1 aspect ration features typical of conventional PVD processes. These technologies in consideration include hot aluminum PVD, ionized plasma deposition, and A1-CVD for traditional subtractive and possibly aluminum damascene structures. Aluminum-based interconnects are expected to dominate fab processes for at least the next five years, inspite of the impending transfer of advanced logic devices to copper-damascene processes.

Product development, Electronic Interconnection Devices, Electronic Connector Manufacturing, Electronic connectors

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Assessing the cost-effectiveness of new technologies

Article Abstract:

A strong indication of the cost-effectiveness of developing new technologies is provided by a forecast of wafer probe while also enabling a company to plan the appropriate number of wafer starts. The probe yield estimation is the most straightforward if new and previous techologies share the same fab, the same manufacturing equipment, a similar process flow, similar pproduct functionality and similar test programs.

Science & research

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