Capability for 300 mm: approaching industry goals

Article Abstract:

The emergence of the 300 mm wafer size conversion is predicted to be the most important transition in the history of the industry. Major specifications and standards for 300 mm wafers, wafer carriers, wafer delivery systems processing and metrology tools, and their equipment interfaces are being tested and modified in 300 mm pilot lines. The opportunities and challenges for future 300 mm factories will be influenced by the technical and economic requirements of both the sub-0.13 micron and 300 mm wafer conversions.

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300 mm moves into the next century

Article Abstract:

The semiconductor industry is positioned to transition to the 300mm wafer size as 300mm facilities are improving their capabilites by employing new automation equipment. The likely timeframe for commencing the ramp of 300mm volume facilities is 2001-2002, as indicated by present economic and capacity analysis. Motorola and Siemens have reported fabrication of 64Mbit DRAMs on 300mm wafers, while other manufacturers announce their planned production of 300mm wafers.

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Surface conditioning

Article Abstract:

Challenges surrounding the 300 mm product development include completely different approaches to wafer management within the tool, increased productivity needs and environmental concerns. The surface conditioning needs of the 300 mm product are likely to be met without many difficulties. Benefits for the industry include attaining more advanced systems with a wider range of processing flexibility, higher productivity and better efficiency.

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