Evaluating wafer inspection and cleaning with standard particles

Article Abstract:

Water surface scanners are used to detect particulate contamination on wafer surfaces. They are normally calibrated with uniform-sized, polystyrene latex spheres. The scanners may, however, provide faulty results because of differences in refractive index and the non-spherical particle shape. The response of a wafer surface scanner and cleaning system evaluation was examined by using a process particle deposition system to deposit PSL spheres and Si, SiO2, W and Cu on wafers. It was discovered that scanner response is affected by the particle refractive index.

Production management

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A word about innovation

Article Abstract:

The semiconductor industry is facing dropping product prices even with the launching of new products and/or use of new technologies. To cope with this market trend, semiconductor manufacturers should realized that entering acquisition, merger or strategic alliance agreements is not their only option. They are advised to closely look at the process of innovation that their companies are employing and to make sure that they are maintaining and nurturing the creative process.

Unit costs & prices

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How to reduce plasma damage in sputtering processes

Article Abstract:

The impact of plasma damage caused during the sputter etch step before second-level aluminum metalization is examined. The sputter etch step is crucial in eliminating the insulating the aluminum oxide from the surface. The influence of important etching parameters on plasma charging was also studied. Researchers were able to develop a new process that boosted device output through an examination of the results.

Manufacturing processes

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