Front-projection HTPS panels shift to 300mm wafers

Article Abstract:

Seiko Epson Corp. is planning to manufacture 300mm quartz glass wafers for high-temperature polysilicon (HTPS) panels at its facility in Hokkaido, Japan. The company will use the wafers in panels of 3LCD projectors and televisions.

Japan, Seiko Epson Corp., Chip sets (Computers), Chipsets, Chipset

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Intel, Dolby team up to enhance computer audio abilities

Article Abstract:

The deal between Intel Corp. and Dolby Laboratories to develop computer platforms that delivers deluxe audio by combining the latest Pentium chips and Pro Logic or Surround audio technologies is discussed.

Intel Corp., INTC, Audio equipment industry, Dolby Laboratories Inc.

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Zoran chip boosts performance of Samsung digital cameras

Article Abstract:

Increase in performance of digital cameras developed by Samsung Electronics Co., Ltd. as a result of using Zoran Corp.Es Coach processor, is discussed.

South Korea, Product quality, Consumer electronics industry, Quality management, Samsung Electronics Company Ltd., Zoran Corp., ZRAN

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