Makers' new chipset designed to step up adoption of 3G services

Article Abstract:

The details of the new chipsets exhibited in the 3G World Congress, which is a trade show of mobile phone industry, held in November 2004 in Hong Kong are presented. The new chipsets are developed to support the third generation mobile services.

Product information, Hong Kong, Reports, Chip sets (Computers), Chipsets, Chipset

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3GSM show banks on HSDPA as next mobilecom wave

Article Abstract:

Synopsis on 3GSM World Congress in Cannes, France is presented. The event focused on High-Speed Downlink Packet Access telecommunication system technology.

France

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Digital shift transforms CCTV to more than security tool

Article Abstract:

The increasing use of closed circuit television camera systems with digital technology i n Japan is examined.

Japan, Radio and Television Broadcasting and Wireless Communications Equipment Manufacturing, Closed Circuit TV Equipment, Usage, Closed circuit television equipment

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