Polymer process produces deep holes with high-aspect ratio

Article Abstract:

Surface Technology Systems of Newport, Wales, has developed an advanced silicon etch process which enables holes close to 40 times deeper than their diameter to be made with nearly vertical silicon walls. The technology is a possible answer to the increasing need for precision micromachining in the production of sensors and actuators. The company uses a cyclic process which is based on fairly conventional dry plasma etching. According to the company, an anisotropy of more than 99% can yield an etch rate of 3 mm/min, with vertical smoothness of more than 0.25 mm and a horizontal flatness of more than 0.1 um.

Comment:

Has developed an advanced silicon etch process which enables holes to be made with almost vertical silicon walls

United Kingdom, Metal Coating, Engraving (except Jewelry and Silverware), and Allied Services to Manufacturers, Etching Equipment, Article, Surface Technology Systems

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Thermoplastic adhesives: alternative to thermosets

Article Abstract:

The advantages which thermoplastic adhesives have over thermoset adhesives include lower stress, higher thermal conductivity, lower modulus and easier rework. Thermoplastics have been shown to perform similarly to and are better than thermoplastics in single-package, MCM applications and in other important areas. Their most important characteristic is their low stress which make them an excellent choice for stress-sensitive dice. Their ability to meet military requirements has also been exhibited.

United States, Adhesive Manufacturing, Synthetic & Rubber Adhesives

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