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Electronics and electrical industries

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Sharp, Mistsui wrap up deal for chip packages

Article Abstract:

Sharp Corp has agreed to license tis chip-scale packaging technology to Mitsui High-Tec Inc. Under the agreement, Mitsui will assemble and manufacture chip-scale packages (CSPs) for Sharp on a commission basis. To meet growing demand, both companies will also work together to strengthen their supply systems. They expect an increase in demand for CSPs, particularly from the mobile communications equipment industry.

Publisher: Dempa Publication Inc. (Japan)
Publication Name: Journal of the Electronics Industry
Subject: Electronics and electrical industries
ISSN: 0385-4515
Year: 1999
Ceramic Semicon Pkgs, Ceramic semiconductor packages

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M61040FP controller ICs

Article Abstract:

Seiko Instruments Inc of Japan has introduced a new control IC in 1999. The M61040FP control IC, which is being marketed by Mitsubishi Electric Corp, is designed to monitor voltage and current of batteries, such as a lithium ion battery. It is available in 20-pin plastic package and costs $3.50 per sample. It also features a microcontroller interface to reduce the need for external parts.

Publisher: Dempa Publication Inc. (Japan)
Publication Name: Journal of the Electronics Industry
Subject: Electronics and electrical industries
ISSN: 0385-4515
Year: 1999
Product introduction, Integrated Circuits by Function, Integrated circuits, Application specific integrated circuits

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