Thermal processing: shrinking devices on larger wafers

Article Abstract:

A unprecedented demand for process temperature and layer thickness uniformity and repeatability has arisen from the continuing decrease in transistor dimensions. Complying with a tightening of semiconductor process variation and increased wafer size puts even more demand on equipment manufacturers to design uniform, low-thermal-budget reliable and robust processes. Fabs using rapid thermal processing cells for all depositions and anneals benefit from greatly reduced thermal budgets, decreased particle generation, better control over smaller device dimensions and a 30% reduction in both cycle times and waferes in process.

Petroleum Refineries, Thermal Processes

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Using SEMs for automatic defect monitoring

Article Abstract:

The use of an automatic Scanning Electron Microsocope (SEM) review tool with built-in automatic defect classification capability for classified defect monitoring in a production environment was examined. The relationship between class accuracy and class purity, the two common measures used in monitoring classified defect density, was quantified using a double review scheme over an extended time period. Results indicate that automatic defect review and classification by SEM is an effective tool for defect monitoring and yield enhancement in advanced technologies.

Electron & Proton Microscopes, Analytical Laboratory Instrument Manufacturing

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Qualifying flip-chip underfills

Article Abstract:

Research was conducted at the Fraunhofer Institute to qualify five underfill materials from different manufacturers. The underfills were subjected to thermal cycling tests, acoustic iamging, scaning electron microscopy and electrical tests. Results reveal that only two of the five underfill materials met the flip-chip requirements obtained from automotive standards of enduring 1,000 cycles before the first failure.

Railroad Rolling Stock Manufacturing, Railroad Equipment

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