Crisis in technology: the questionable U.S. ability to manufacture thin-film multichip modules

Article Abstract:

The ability to buy MCM-D multichip modules in the US is threatened by the inability to obtain volume orders, which is causing the withdrawal of capital at the very time when the capabilities are more and more certain. Laminated multichip technology delivers assemblies at low cost for the modest densities required for many commercial applications and for speeds slower than 75 MHz. Deposited dielectric technology delivers at the same low costs for volume orders but has insufficient volume orders, with the possible exception of AT&T. The only devices that can be used at system cycle speeds over 200 MHz are deposited dielectric multichip modules, and only thin-film multichip modules can perform at those frequencies, but there may not be enough thin-film multichip module capacity if producers fold before receiving volume orders. A plan is outlined to stimulate volume production of thin-film multichip modules and to avoid a duplication of the problems of manufacturing Group III fax machines.

Semiconductor industry, Technology, Thin film circuits, Multichip modules, End users, Financial Analysis Software, User Need, Industry Analysis, Manufacturers, Production, Policy, Thin-Film Circuits, Multichip Module

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Quantum mechanical aspects of transport in nanoelectronics

Article Abstract:

Semiconductor technological innovations enable the examination of devices with dimensions under 100 nm. The implications of quantum mechanics on the performance of nanometer-scale devices is discussed. The physical dimensions of individual electronic devices and the interconnections between transistors have plummeted. The confinement and coherence of electronic motion on the scale of the electron wavelength at low temperature produces gross deviations from classical charge transport that describes the resistance in large, conventional devices.

Semiconductor devices, Electronic components, Nanotechnology, Product introduction, Quantum electronics, Temperature, Semiconductor Device, New Technique

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