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Engineering and manufacturing industries

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Bolstering infrastructure through boom and bust

Article Abstract:

Boom and bust is the nature of any high-technology industry. This includes the defense industry, which is dependent on the whims of Congress. At the Navy's encouragement, Grumman Corp sank $200 million into modernizing one of its subassembly plants. With several defense contracts being wound down or cut back, Grumman finds itself with an under-utilized modern plant in which it may never recover its investment. Other government actions also contribute to self-defeating practices in defense procurement. Controlling profit margins, costs, and manipulating the competitive situation has ended up perpetuating some of the problems that were meant to be avoided, such as high costs and inefficient manufacturing. Profit margins negotiated at a percentage of estimated costs gives the contractor little incentive to bid low.

Author: Santo, Brian
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1988
Contracts, Weapons industry, United States. Department of Defense, Purchasing Systems, Defense Contract, Regulation

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BiCMOS circuitry: the best of both worlds

Article Abstract:

Configuration of the united bipolar and complimentary metal oxide semiconductor (CMOS) circuitry - biCMOS - involves compromise between the two technologies. Benefits associated with bipolar integrated circuits include faster switching, greater current drive and superior suitability for analog applications. CMOS ICs use less power, dissipate less heat and pack in more devices than bipolar chips do. When designers combine the two they can reach a speed versus power middle ground unachievable with either CMOS or bipolar configurations alone. BiCMOS chips require a more complex production process. BiCMOS technology has been used for analog applications for 15 years and is now being considered for digital applications.

Author: Santo, Brian
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1989
Integrated circuits, Circuit design, CMOS, Bipolar Integrated Circuits, Configuration

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Plans for next-gen chips imperiled

Article Abstract:

The prospects of a delay in the launch of the extreme-ultraviolet lithographic chips by Nikon Inc. are discussed.

Author: Santo, Brian
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2007
Product development, Photographic equipment and supplies, Photographic studios, portrait, Photographic Services, Photography Studios, Portrait, United States, Photographic industry, Nikon Inc.

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