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Engineering and manufacturing industries

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Abstracts » Engineering and manufacturing industries

Here comes the wallet phone

Article Abstract:

Japan's NTT DoCoMo along with Sony's FeliCa Chip has developed a phone which can be used as a boarding pass in certain domestic flights to authorize entry at corporate security doors and also make electronic purchases at stores equipped with FeliCa readers.

Author: Boyd, John
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2005
Product development, Household audio and video equipment, Alliances, partnerships, Consumer electronics industry, Sony Corp., Telephone, Telephony, SNE, Cooperative agreement for product development, Alliances and partnerships

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Tokyo power quake-proofs its grid control system

Article Abstract:

The strategies applied by Tokyo Electric Power Co. (Tepco), to provide uninterrupted power supply in Japan, which is more prone to natural disasters.

Author: Boyd, John
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2006
Electric Utilities, Electric Power Generation, Transmission and Distribution, Electric services, Technology application, Tokyo Electric Power Company Inc.

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Sneak peek at cellphone future

Article Abstract:

Tests carried out by Japan's phone company NTT DoCOMo Inc. which transmitted large amount of packet data to a moving vehicle is discussed.

Author: Boyd, John
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 2006
Product information, Analysis, Data transmission media

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Subjects list: Japan, Cellular telephone services industry, Cellular telephone services, NTT DoCoMo Inc., Wireless telecommunications service
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