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A cyclic microbend study on LIGA Ni microelectromechanical systems thin films

Article Abstract:

The results of recent studies of cyclic microbend experiments and their consequences for plasticity length-scale phenomena in LIGA Ni microelectromechanical systems (MEMS) thin films are presented. The implications of the results are then discussed for the analysis of plasticity and cyclic deformation in MEMS structures and other microscale systems.

Author: Lou, J., Shrotriya, P., Soboyejo, W.O.
Publisher: American Society of Mechanical Engineers
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2005
Nickel alloys, Microelectromechanical systems

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An investigation of the effects of microstructure on fatigue crack growth in Ti-6242

Article Abstract:

The results of a combined experimental and analytical investigation of pure fatigue in smooth hourglass specimens of Ti-6242 with equiaxed, elongated and colony microstructures are presented. The implications of the results are discussed for life prediction and nondestructive inspection of aeroengine structures and components from Ti-6242.

Author: Soboyejo, W.O., McBagonluri, F., Akpan, E., Mercer, C., Shen, W.
Publisher: American Society of Mechanical Engineers
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2005
Aircraft Engines & Parts, Aircraft Engine and Engine Parts Manufacturing, Aircraft Engine R&D & Services, Aircraft engines, Fatigue, Structure

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A study of creep in polysilicon MEMS devices

Article Abstract:

An experimental micro test structure is developed and measurements of high temperature plastic deformation within polysilicon are conducted. The results show that both increases in temperature and stress are shown to increase the creep rate within the studied beams in the region of interest of the test device.

Author: Tuck, K., Jungen, A., Geisberger, A., Ellis, M., Skidmore, G.
Publisher: American Society of Mechanical Engineers
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2005
Polysilicon, Creep

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Subjects list: Testing, Deformations (Mechanics), Deformation, Mechanical properties, Materials
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