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Micromechanical simulation of dynamic fracture by using the cohesive finite element method

Article Abstract:

The influence of microstructural morphology on the fracture behavior, the influence of phase size on fracture resistance, the effects of interphase bonding strength on failure and the effect of loading rate on fracture, are analyzed. The fracture behavior is significantly influenced by microscopic phase distribution and phase size scale.

Author: Jun Zhai, Tomar, Vikas, Min Zhou
Publisher: American Society of Mechanical Engineers
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2004
Grammar, Comparative and general, Morphology (Linguistics)

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Micromechanical simulation of dynamic fracture by using the cohesive finite element method

Article Abstract:

The influence of microstructural morphology on the fracture behavior, the influence of phase size on fracture resistance, the effects of interphone bonding strength on failure and the effect of loading rate on fracture, are analyzed. The fracture behavior is significantly influenced by microscopic phase distribution and phase size scale.

Author: Tomar, Vikas, Zhai, Jun, Zhou, Min
Publisher: American Society of Mechanical Engineers
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2004
Structural analysis (Engineering)

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Pseudoelasticity of single crystalline Cu nanowires through reversible lattice reorientations

Article Abstract:

The structure and mechanical behavior of Cu nanowires with lateral dimensions of 1.45-2.89 nm is analyzed with the help of molecular dynamic simulations. A pseudo elastic behavior driven by the high surface-to-volume ratio and surface stress at the nanoscale is observed for the transformed wires.

Author: Min Zhou, Wuwei Liang
Publisher: American Society of Mechanical Engineers
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2005
United States, Science & research, Primary copper, Secondary nonferrous metals, Research, Nanotechnology, Copper, Mechanical properties, Copper (Metal), Structure

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Subjects list: Analysis, Fracture (Materials)
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