Ultra-broadband MMIC circuit design

Article Abstract:

Travelling wave amplifiers (TWA) comprise parallel connections of active devices such as valves, FETs or bipolar transistors. The design of TWAs depends on knowledge of the lumped element model for the transistor. The FET can be modelled by a range of elements and its gain is determined by the number of stages and the their transconductance. A five-stage TWA was designed using cascode active elements, using the GMMT H40 HEMT Foundry process. This result in a broadband circuit, having flat gain response with good input and output match.

Integrated Circuits, Electron Tube Manufacturing, Electron tubes, Traveling Wave Tubes, Models, Usage, Circuit design, Amplifiers, Amplifiers (Electronics), Traveling-wave tubes

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Low-cost flip-chip process for monolithic microwave integrated circuits and optical components

Article Abstract:

Wire bonding can be problematical for devices operating at frequencies above a few GHz, due to the unacceptably large electrical impedance. An alternative method is flip-chip solder bonding which can achieve attachment and interconnection between electronic components and substrates simultaneously. A flip-chip soldering process for attaching GaAs MMIICs has been developed, where MMICs are only available as individual die with conventional gold bond pads.

Microwave Integrated Circuits, Solder and soldering, Soldering, Solders

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IFMS - ESA's new, all-digital tracking, telemetry & command system

Article Abstract:

The Intermediate Frequency and Modem System (IFMS) will provide ranging, telemetry and telecommand services for near-earth and deep-space. It is currently under development by GEC-Marconi and ATNR. Digital signal processing techniques have been used extensively, which ensures high performance and long-term stability. The novel polarization diversity combiner can run with both remnant and suppressed carrier modulation formats.

Digital ICs NEC, Digital integrated circuits, Digital signal processors, GEC-Marconi

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