Projecting yields using bitmap analysis

Article Abstract:

Defect density information for the critical process layers of non-memory products can be readily obtained through the use of strip-back and memory bitmap analysis. The system goes through the identificationn of failing bits through a bitmap tester, then inspecting the area for defects via an optical microscope. After the completion of bitmap and critical area analysis for the memory and non-memory product, the calculation of yield limits starts with the use of a negative binomial equation.

Products & technology - general, Integrated Circuits

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IMEC, SEMATECH show feasibility of a sub-2.0 low k dielectric

Article Abstract:

A report on the feasibility of an ultralow-k film developed by Dow Corning was presented at IMEC and SEMATECH. The film's ability to endure etching, CMPP, ashing and cleaning processes while avoiding mechanical or chemical damage to the low-k material was evaluated. The work was compplemented by a team of researchers at IMEC which integrated the low-k dielectric in a 0.2 micron single-damascene copper structure. The refractive index, thermal stability and susceptibility to moisture absorption was determined.

Science & research, Semiconductor Parts

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Solving the integration challenges of low-k dielectrics

Article Abstract:

The integration of low-k materials with a dielectric constant below 3.0 presents challenges to manufacturers of integrated circuits. The problem starts with the selection of material itself, from among organic and inorganic, spin-on and CVD candidates. Material choices for 0.13 um devices appear to be the porous versions of organic polymers, particularly the polyarylenes and polyarylene-ethers such as Dow Chemical's SiLK and AlliedSignal's FLARE.

Semiconductor Devices, Use of materials & supplies

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