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Electronics and electrical industries

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SCALPEL provides best strategic fit for Lucent

Article Abstract:

Lucent Technologies is supporting SCALPEL-based technologies among next- generation lithography technologies primarily because of mask costs, said David Eaglesham, director of the Silicon Electronics Research at Lucent's Bell Labs. While SCALPEL creates a trade-off between resolution and throughput, improvements in next generation of tools should result in increases in numerical aperture that more that offset the decrease in throughput, added Eaglesham.

Author: DeJule, Ruth
Publisher: Reed Business Information, Inc. (US)
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 2000
Lucent Technologies Inc.

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DUV cluster tools go mainstream

Article Abstract:

The increasing popularity of DUV lithography has propelled the trend towards the more flexible and controllable cluster systems, which also enhances productivity, consistency and timing. Among the available systems in the market is Silicon Valley Group's ProCell hexagonal system. The platform, which utilizes an advanced guidance system, processes over 40 wafers simultaneously and can finish the lithography process in 12 balanced moves.

Author: DeJule, Ruth
Publisher: Reed Business Information, Inc. (US)
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999

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SCALPEL masks progress

Article Abstract:

Motorola has developed a new process that produced the first 200 mm SCALPEL (Scattering with Angular Limitation in Projection Electron beam Lithography) mask designed for a microprocessor-level device with 0.18 micrometer minimum geometries. The process involves depositing a low atomic number membrane material on both sides of a silicon substrate. The result is an e-beam patterned, microprocessor level extreme-ultraviolet mask.

Author: DeJule, Ruth
Publisher: Reed Business Information, Inc. (US)
Publication Name: Semiconductor International
Subject: Electronics and electrical industries
ISSN: 0163-3767
Year: 1999
Metal Semicon Pkgs, Motorola Inc., Metal semiconductor packages

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