Moulded sensors are easily fixed
Article Abstract:
IFM Electronic has introduced new photoelectric sensors which are particularly suited to harsh environments because they are contained in moulded plastic bodies. Other innovations include an ingenious new mounting bracket which allows for easy adjustment, and the use of smart electronics and a single recessed button for improved setting up. The plastic bodies ensure the sensors are suitable for environments including those where hosing or steam cleaning is used, but they also reduce costs, making these sensors approximately 10% cheaper than previous models.
Publication Name: Eureka
Subject: Engineering and manufacturing industries
ISSN: 0261-2097
Year: 1997
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Adaptive damper smooths bike ride
Article Abstract:
A new variable rate shock absorber for use on mountain bikes, agricultural vehicles and racing cars has been developed by Advanced Fluid Systems. The shock absorber is operated by two PP3 batteries which supply a magnetic or electric field. The field changes the viscosity of the fluid in the damper and varies the shock absorbing properties. Cyclists are interested in this type of shock absorber because, at the moment, they have to get off their bicycle to alter the settings, and this new system is operated on the handlebars.
Publication Name: Eureka
Subject: Engineering and manufacturing industries
ISSN: 0261-2097
Year: 1997
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Micro fabrication sets new benchmarks
Article Abstract:
Lucas NovsaSensor has refined the silicon bonding fusion (SBF) process and it can now produce components with higher levels of performance. Very small components, such as an accelerometer, can be made when SBF is used together with deep reactive ion etching (DRIE). The small components mean that the control equipment in which they are used can also be made smaller. Details of the SFB and DRIE process are given.
Publication Name: Eureka
Subject: Engineering and manufacturing industries
ISSN: 0261-2097
Year: 1997
User Contributions:
Comment about this article or add new information about this topic:
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