Wireless growth spurs electronic-component makers
Article Abstract:
A report from Allied Business Intelligence forecasts that manufacturers of wireless infrastructure and components for the new personal communications services (PCS) will register unprecedented growth throughout the next five years. Growth is expected to be robust for such components as application-specific integrated circuits (ASICs), digital signal processors (DSPs) and field-programmable arrays (FPGAs), and particularly strong for infrastructure directly due to greater integration of tasks into single chips, as well as the development of more-powerful DSPs that can handle four to six conversations per chip. The report anticipates 429 million subscribers for PCS worldwide in its moderate-growth, and 777 million subscribers in its aggressive-growth estimate.
Comment:
World: Makers of wireless infrastructure/parts for new personal communications svcs will post unprecedented growth in next 5 yrs
Publication Name: Microwaves & RF
Subject: Engineering and manufacturing industries
ISSN: 0745-2993
Year: 1998
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CMOS technology adjusts to RF applications
Article Abstract:
Complementary metal-oxide-semiconductor (CMOS) technology is anticipated to become a feasible option for RF designs into the 2-GHz range, amid recent improvements in the field. There is considerable impetus for the continued development of CMOS technology, as it is regarded as a potent contender for the proposed IMT-2000 global wireless system of the International Telecommunications Union. The CMOS realization of RF circuits offers various advantages, including low fabrication costs and easier integration with digital circuitry, although RF CMOS remains constrained by several limitations concerning implementation of high-performance RF components.
Comment:
World: CMOS technology may become a feasible option for RF designs into the 2-GHz range, amid recent improvements in the field
Publication Name: Microwaves & RF
Subject: Engineering and manufacturing industries
ISSN: 0745-2993
Year: 1998
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Converting signals in SDH/SONET systems
Article Abstract:
Maxim Integrated Products Inc of Sunnyvale, CA, has developed a chip set called STM-4 for designing optical electrical units. The chip was designed to meet important criteria including power dissipation, supply voltage, integration level and performance margin. STM-4 was fabricated using a fast complementary bipolar process and a high-speed submicron bipolar process capable of 27-GHz transition frequencies in NPN transistors.
Publication Name: Microwaves & RF
Subject: Engineering and manufacturing industries
ISSN: 0745-2993
Year: 1998
User Contributions:
Comment about this article or add new information about this topic:
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