Abstracts - faqs.org

Abstracts

Chemicals, plastics and rubber industries

Search abstracts:
Abstracts » Chemicals, plastics and rubber industries

Dimension, strength and chemical and thermal stability of a single C-C bond in carbon nanotubes

Article Abstract:

For single-walled carbon nanotubes (SWCNTs), given the known product of the Young's modulus Y and the wall thickness t and the known temperature of tip-end melting (T(sub m) = 1593 K) as well as their functional dependence on atomic coordination and bonding energy, the dimension and strength of a C-C bond in a SWCNT are determined. The solution reveals that the C-C bond is ~0.142 nm thick and ~0.125 nm long with a 68% increase in binding energy, with respect to the bulk graphite values.

Author: Chang Q. Sun, H.L. Bai, B.K. Tay, S. Li, E.Y. Jiang
Publisher: American Chemical Society
Publication Name: Journal of Physical Chemistry B
Subject: Chemicals, plastics and rubber industries
ISSN: 1520-6106
Year: 2003
Energy metabolism, Bioenergetics, Graphite, Carbon compounds, Chemical properties

User Contributions:

Comment about this article or add new information about this topic:

CAPTCHA


Impact of bond order loss on surface and nanosolid mechanics

Article Abstract:

An analytical solution demonstrated that a competition between bond order loss and the associated bond strength gain of the lower coordinated atoms near edge of a surface dictates the mechanics of the surface and hence, a nanosolid. It concluded that the bond loss lowers the activation energy for atomic dislocation, whereas bond strength gain enhances the energy density or mechanical strength in the region near the surface.

Author: Li, S., Chang Q. Sun, Li, C.M.
Publisher: American Chemical Society
Publication Name: Journal of Physical Chemistry B
Subject: Chemicals, plastics and rubber industries
ISSN: 1520-6106
Year: 2005
Science & research, Research, Nanotechnology, Chemical bonds

User Contributions:

Comment about this article or add new information about this topic:

CAPTCHA


Determinants of thermal conductivity and diffusivity in nanostructural semiconductors

Article Abstract:

A unified nanothermodynamic model was developed to study the origin of the size effects in the thermal conductivity and diffusivity of nanostructural semiconductors. The results provide insight into the fundamental understanding of high-performance nanostructural semiconductors which could be used in optoelectronic and thermoelectric devices.

Author: C.C. Yang, S. Li, Armellin, J.
Publisher: American Chemical Society
Publication Name: Journal of Physical Chemistry B
Subject: Chemicals, plastics and rubber industries
ISSN: 1520-6106
Year: 2008
All Other Basic Inorganic Chemical Manufacturing, Industrial inorganic chemicals, not elsewhere classified, Silicon, Semiconductors, Thermal properties, Diffusion, Diffusion (Physics), Heat, Semiconductors (Materials), Heat conduction

User Contributions:

Comment about this article or add new information about this topic:

CAPTCHA


Subjects list: Analysis
Similar abstracts:
  • Abstracts: Conformational selectivity of peptides for single-walled carbon nanotubes. pH-dependent stability of decalysine alpha-helix studied by explicit-solvent molecular dynamics simulations at constant pH
  • Abstracts: Predictions of enhanced chemical reactivity at regions of local conformational strain on carbon nanotubes: kinky chemistry
  • Abstracts: Dynamics of C60 encapsulation into single-wall carbon nanotubes. Microstructure and growth model of periodic spindle-unit BN nanotubes by nitriding Fe-B nanoparticles with nitrogen/ammonia mixture
  • Abstracts: Surface treatment to enhance the quantum efficiency of semiconductor nanocrystals. Fluorescence anisotropy and crystal structure of individual semiconductor nanocrystals
  • Abstracts: Collections of copper nanocrystals characterized by different sizes and shapes: optical response of these nanoobjects
This website is not affiliated with document authors or copyright owners. This page is provided for informational purposes only. Unintentional errors are possible.
Some parts © 2025 Advameg, Inc.