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Engineering and manufacturing industries

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Solid state

Article Abstract:

Major developments in reduced-instruction-set computer (RISC) processors, static- and dynamic-random-access-memory (SRAM, DRAM) integrated circuits (ICs), mixed-signal (analog and digital) chips, and IC packaging and production were seen in 1989. Intel Corp introduced three one-million-plus transistor microprocessors, the RISC-based i860, 80486, and i960 controller. Several firms shipped 4M-bit DRAMs, while other semiconductor vendors joined those with prototype 16M-bit DRAMs. BiCMOS devices were used to improved SRAM density and speed, and the $100 million 1989 market for biCMOS SRAMs may grow to $500 million in 1992. Integration of analog and digital circuitry on one chip is rapidly growing, particularly for intelligent power ICs and analog-to-digital converters. Neural network ICs, complementary bipolar operational amplifiers, and IC materials and production trends are discussed.

Author: Chen, Katherine T., Santo, Brian
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1990
Semiconductor industry, DRAM, Business conditions, Product Introduction, Trends, Review of Past Year, RISC, RISC processors, SRAM, SRAM (Static random access memory)

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X-ray lithography: the best is yet to come

Article Abstract:

X-ray lithography, long predicted to take over the functions of optical lithography, may soon become a reality. X-ray lithography is a method of integrated circuit production. A 0.5-micrometer, four-level NMOS test chip was recently developed by IBM Corp, as well as a more complex CMOS version with functional memory cells. Other companies like Sortec of Japan and Cosy Microtec in West Berlin intend to develop a commercially viable X-ray source and complementary technologies by 1996. The US Department of Defense has also been funding related projects under the very high-speed integrated circuit (VHSIC) program. Despite all these, the value of x-ray lithography remains unclear but companies will continue to pursue the technology as long as the risk of being left behind in product development outweighs the risk of developing an ineffective product.

Author: Santo, Brian
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1989
Integrated circuit fabrication, Product introduction, X-rays, New Technique

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1K-bit DRAM: 1970

Article Abstract:

Intel Corp was founded to develop new memory ICs, and the firm's 1103 1K-bit DRAM was the industry leader from 1970 to 1979, with over 35 million sold. IBM's 1968 commitment to semiconductor memory for its IBM System 370-Model 145 mainframe caused its competitors to incorporate memory ICs in their systems. Honeywell Inc approached Intel for a 512bit DRAM, which intel developed into the 1103. Bob Abbott was the chief designer of the chip; John A Reed was brought in to handle problems when the chip didn't perform as expected. Demand for the 1103 required Intel to second-source manufacturing through Microsystems Intl Ltd of Canada. The 1103 was a difficult IC to use and design.

Author: Santo, Brian
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication Name: IEEE Spectrum
Subject: Engineering and manufacturing industries
ISSN: 0018-9235
Year: 1988
Intel Corp., INTC, Systems analysis, RAM, RAM (Random access memory), Systems development, Computer history, System Development, System Design, History of Computing, Dynamic Cell

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Subjects list: Integrated circuits, Product development, DRAM (Dynamic random access memory)
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