Test system coming for big semi wafers

Article Abstract:

Hewlett-Packard Co. has been commissioned by Siemens AG to serve as the semiconductor parametric test-solution provider for Semiconductor300. A joint venture between Siemens and Motorola Inc., Semiconductor300 is designed to develop an operating technology for the production of 12-inch, or 300-nm, wafers, which will enable the two manufacturers to produce more chips per wafer and achieve cost reduction. As part of the task, HP will furnish the HP Semicondcutor Process Evaluation Core Software, and HP4071A semiconductor parametric test systems, for a 300-mm pilot manufacturing line at Siemens' Dresden, Germany facility. The task includes a comprehensive turnkey solution encompassing all hardware and test-software services, aside from wafer-prober integration.

Comment:

Commissions Hewlett-Packard Co to provide semiconductor parametic test equipment for the Siemens-Motorola Semiconductor300 JV

Semiconductor and Related Device Manufacturing, Germany, Facilities & equipment, New orders received, Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals, Semiconductor Production Equip, Semiconductor Machinery Manufacturing, Integrated Circuits, Semiconductor Test Equip, Hewlett-Packard Co., Semiconductor production equipment, Siemens AG, Semiconductor test equipment, Article

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Plastic bridges the thermoplastic elastomer gap

Article Abstract:

A new joint venture between DuPont and Dow Chemicals has developed an innovative plastic material family, called Engage. DuPont Dow Elastomers has developed the new line of polyolefin elastomers for applications including laboratory tubing, automotive bumpers and cable insulation. There are 23 grades available of the high-performance ethylene-octane copolymers which are superior to EVA, PVC and styrene block copolymers.

Product development, Product introduction, Polyolefins, Elastomers, Thermoplastics, DuPont Dow Elastomers

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