Debugging microchips at light speed

Article Abstract:

IBM researchers have developed a PICA as a way to see where chips are flawed. Using a microscope, a photon detector, and a computer, the process sends light pulses through a chip and allows observes to see where an electrical impulse is late, or too weak, or too strong. Intel has developed a testing system using infrared light. 5 or 10 flawed transistors, in a chip made up of millions, can cause as much as a 25% decline in performance.

Microprocessor Chips, Digital Integrated Circuits, Statistical Data Included, Research, Microprocessor, CPUs (Central processing units), Microprocessors, Technology development, Quality management

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Several rough years are seen for semiconductor industry

Article Abstract:

The Semiconductor Equipment and Materials International trade group forecasts a slowdown of 35% for the semiconductor equipment industry in 2001, to $31 billion. 2000 was the record year for the industry with sales of $47.7 billion. The trade group predicts the industry will not surpass 2000 sales until the year 2004.

Forecasts, trends, outlooks, Forecasts and trends, Market trend/market analysis, Semiconductor Equipment and Materials International

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Intel develops a new ay to produce silicon chips

Article Abstract:

Intel is introducing BBUL, bumpless buildup layer structure which will quicken the development of microchips with more than a billion transistors, possibly available by 2006. The method involves packaging, the layers around the chip, getting rid of solder bumps (good for the environment) and connecting copper wire from the core of the package to the processor.

Manufacturing processes, Production management, Intel Corp., INTC, Company technology development

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