Creep behavior and deformation mechanisms map of Sn-Pb eutectic solder alloy

Article Abstract:

The study presents a large number of creep tests that were carried out using miniature specimens in order to gain a fundamental understanding of the creep behavior. A deformation mechanisms map was established for the widely used Sn-Pb eutectic solder alloy in order to interpret the creep mechanisms under different temperatures and loading conditions.

Creep

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Computer identification of structural weaknesses in locally anisotropic polycrystalline materials

Article Abstract:

The behavior of mesoscopic stress responses in a simulated polycrystalline material sample containing a large amount of constituent grains for a number of polycrystalline materials is investigated by performing computer experiments. The homogenization of materials with locally anisotropic microstructure is discussed.

Stress analysis (Engineering), Polycrystalline semiconductors

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Constitutive relations for inelastic deformation and damage accumulation in hard alpha titanium

Article Abstract:

A set of constitutive data is used to develop constitutive equations for describing the inelastic deformation and damage accumulation behavior of hard alpha Ti. A treatment of the damage accumulation process is required to give an accurate description of the inelastic flow of hard alpha with high nitrogen content.

Titanium alloys, Mechanical properties

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