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Effect of geometry and materials on residual stress management in thin films by using the focused ion beam

Article Abstract:

A method for residual stress measurements in thin films by using the focused ion beam (FIB) is presented. A simple equation based on two-dimensional elasticity is used to evaluate the residual stress from the displacements due to introducing a slot. The effect of material dissimilarity between film and substrate is explored.

Author: Ki-Ju Kang, Darzens, Severine, Gee-Seob Choi
Publisher: American Society of Mechanical Engineers
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2004
Science & research, Research, Residual stresses, Mechanical properties, Substrates

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Instrumented microindentation of nanoporous alumina films

Article Abstract:

The mechanical behavior of anodic alumina thin films with organized nanometer-scale porosity is examined. The films showed increasing hardness/modulus with a decrease in pore volume fraction or transformation from amorphous to a polycrystalline alpha-gamma phase.

Author: Gall, Ken, Liu, Yiping, Routkevitch, Dmitri, Finch, Dudley S.
Publisher: American Society of Mechanical Engineers
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2006
Metal ores, not elsewhere classified, All Other Metal Ore Mining, Alumina, Electric properties, Polycyclic aromatic compounds, Aluminum oxide

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Structure and properties of electrocodeposited Cu-Al2O3 nanocomposite thin films

Article Abstract:

The structure and properties of electrocodeposited Cu-Al2O3 nanocomposite thin films are examined. The hardness of the nanocomposite thin film is found to be approximately 25 percent higher than the hardness of the control films of pure copper.

Author: Yong Gan, Dongyun Lee, Xi Chen, Kysar, Jeffrey W.
Publisher: American Society of Mechanical Engineers
Publication Name: Journal of Engineering Materials and Technology
Subject: Science and technology
ISSN: 0094-4289
Year: 2005
New York, Analysis, Copper compounds, Properties, Structure, Electrodeposition

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Subjects list: Thin films, Dielectric films
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