Hand-picking plant sites, Towa crafts top-end production systems

Article Abstract:

Towa Corp is strengthening its production capacity through the use of advanced equipment that can adapt to the global market changes of the semiconductor industry. Its capital investments for equipment and facilities in FY2000 will probably be 2 billion yen larger than the original plan. Construction began on new headquarters and a new factory for Towa's US subsidiary, Intercon Technology Inc in Morgan Hill, CA. Other machine tools will be added at its Kyushu factory in Penang, Malaysia. The activities are part of the company's efforts to raise production of the super-precision molds for semiconductor manufacturing systems.

Facilities & equipment

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Cutting-edge automation lets Towa meet 21st-century challenge

Article Abstract:

Towa Corp will implement a four-way global production system with fully- automatic semiconductor resin sealing devices at its main focus to meet the changing demands of the semiconductor industry. Its products have become the de facto standard in the semiconductor equipment industry. Towa Pres Kazuhiko Bando said the company will continue to develop new technology to maintain customer loyalty. The company has opened a new headquarters in Kyoto, Japan, and the Towa-AP Center in Singapore.

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Towa devises production system to pace semiconductor growth

Article Abstract:

Towa Corp of Kyoto, Japan, is a leading supplier of products and equipment for the semiconductor-making industry, which is projected to grow to 30 trillion yen in 2000. The company controls 40% of the global market for semiconductor sealing devices. Among its mainstay products are the Y-PC series of automatic semiconductor resin sealing machines, the FC-A series of automatic flip chip assembly systems, the HI-ProChip lead processing system and the CC-S ultra-compact automatic molding system.

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