LSIs stack up memories within packages

Article Abstract:

Sharp Corp. has developed the first series of stacked chip-sized packages. With each containing two LSI chips, the packages are designed to meet demand for drops in LSI package sizes. The 8 x 8mm versions hold 16 eight-bit flash memories and 16 11M-bit SRAMs; the 8 x 11mm versions integrate 16 16M-bit flash memories and eight 12M-bit SRAMs; and the 8 x 10mm version carry eight 16M-bit flash memories and eight 12-bit SRAMs. A die-bonding process developed by the company's engineers ensures that chips are bonded onto package substrates.

Comment:

Develops the first series of stacked chip-sized packages

Product information, Plastic Containers, All Other Plastics Product Manufacturing, Sharp Corp. (Osaka, Japan), Article

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Intel, Via settle squabble about chip set designs

Article Abstract:

United States-based Intel Corp. and Taiwan-based Via Technologies Inc. will settle a group of intellectual property lawsuits.

Taiwan, Semiconductors and related devices, Patents & copyrights, Intel Corp., INTC, VIA Technologies Inc.

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