Bookham commences production

Article Abstract:

Bookham Technology has begun full production of its optoelectronic silicon devices through the operation of a new $10-million manufacturing facility at Abingdon, Oxon, UK. The plant is capable of producing one million devices annually, should it operate at maximum capacity. However, according to Kevin Ford, Bookham's VP of manufacturing, the plant does not have enough space for automated equipment to realize its full production capacity. The facility is aimed at producing a variety of optical devices.

Comment:

Begins full prodn of optoelectronic silicon devices through a new $10-million manufacturing facility at Abingdon, Oxon, UK

United Kingdom, Optoelectronic Devices, Bookham Technology PLC, Article

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TaSiN could replace TaN and Ta as copper barrier

Article Abstract:

Copper-filled damascene lines featuring tantalum silicon nitride (TaSiN) barriers provide lower surface roughness, better interface attributes and lower film stress with copper than Ta or TaN films, according to a recent study conducted by engineers at Austin, TX-based SEMATECH and Santa Clara, CA-based National Semiconductor. The study also shows that film texture is lowest with Ta, medium with TaN and strongest with TaSiN, even though TaSiN is amorphous.

United States, Semiconductors & Parts NEC, Semiconductor devices

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European suppliers focusing on tool productivity

Article Abstract:

Semiconductor manufacturers in Europe are exerting more effort on optimizing the productivity and cost-efficiency of their processes. Central to the industrial trend in production is the Semiconductor Equipment Assessment, which is working to fill the gap between innovation and productivity with its evaluation of equipment for advanced technologies such as 200 mm and 300 mm equipment.

Europe, Semiconductor Devices

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