Sony will device design center in Pittsburgh

Article Abstract:

Sony Electronics Inc is establishing the Sony Semiconductor Design Center in Pittsburgh, PA, in the US. The center will initially concentrate on research and development of semiconductors, featuring personal security technologies for the Internet. The activities will later include semiconductor technologies for wireless networks and broadband networks. The center is expected to offer semiconductor technologies for hardware and software that works in various network environments.

Pennsylvania

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ChipPAC center offers 5-day turnaround

Article Abstract:

ChipPAC of Santa Clara, CA, has a customer packaging development center that provides wire-bonded and flip-chip ball-grid array (BGA) and chip- scale package (CSP) options and allows customers to recieve their IC prototypes within five or fewer days. Since a prototype is delivered immediately, customers can evaluate their BGA and CSP options and chip performance before the prototype goes into production. The center also offers design, thermal and electrical modeling services.

Ceramic Semicon Pkgs, Ceramic semiconductor packages

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Laser PGA slashes months from ASIC design cycles

Article Abstract:

Chip Express Corp, a semiconductor device manufacturer based in Santa Clara, CA, has developed the Laser Programmable Gate Array (LPGA) design methodology that is said to reduce by months the time it takes to design application-specific integrated circuits. The LPGA methodology verifies the design while still in the development stages, allowing design teams to perform prototyping in parallel with other design efforts.

Manufacturing processes

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